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The AVI aims to solve the detection difficulties of the square battery such as multi-faceted, multi-angle and reflective. It realized rapid and comprehensive product detection through DeepSight multi-angle optical technology and AI technology, with full coverage of defects and high detection efficiency.
Scratches, foreign bodies, breakages, folds, flanges, electrolytes
The intelligent FPC AVI is designed for products such as flex boards and IC boards. It adopts high-precision line scan cameras (5μ, 10μ, 15μ precision), condensing patent technology of DeepSight multiple imaging systems, AI platform, and other AVI technology. Each module of the equipment operates independently, making the inspection more stable. Users can quickly switch between inspections of different models of products by importing module files. The equipment also supports front and back double-sided detection, which improves efficiency.
Hotbar, film, pad, reinforcement and other over 100 defects detection, such as crushing, copper leakage, foreign body, deviation
The AVI detects the hexahedron of the communication module through the innovative imaging system composed of multiple cameras and light sources. The high-precision robotic arm quickly cooperates with product movement, and multi-sided synchronous detection effectively reduces the detection time. The unique optical imaging technology helps cover all defects with bumps and abnormal angles. The AVI also supports multi-model fast switching, automatic loading, and unloading detection, achieving full AI inspection with high accuracy.
scratches, dirt, bumps, copper leakage, tin dip, QR codes, characters, warpage, etc.
The camera module AVI is a set of six-sided inspection equipment used for various camera modules and chip products. It adopts multiple image optical technology to ensure full coverage of various defects. With full intelligent detection algorithms, it detects multiple areas such as connectors, flex boards, and reinforcement. The AVI greatly increases its inspection capacity by running multiple stations synchronously.
scratches, crush, broken connectors, cracks in reinforcing glue, white spots in clear holes, etc.
The AVI is developed for the detection of various metal polyhedra products. It supports the detection of five surfaces, including the upper and lower surfaces and the inner side, through a multi-station setup. Combined with exclusive optical detection technology and structural design, the device enables fast and comprehensive product inspection. It is suitable for multiple models, supporting fast switching to realize a variety of inspections.
under-grinding, pits, crushing, scratches, rust, pitting, mixing, and chamfering
Wafer AVI is used to detect various defects of semiconductor wafers in the process of manufacturing. Through multi-station optical imaging settings, the corresponding size and defect problems are respectively detected to ensure full coverage of defects. Combined with a variety of detection algorithms, it ensures good detection results and achieves better stable applications.
Foreign bodies, hanging burrs, breakage, filaments, contaminated particles, warping, and corresponding dimensional measurements